Technologies
Microsystem and Nanosystem Technologies at CMT
- Design and fabrication of photolithographic masks
- photolithography
- planar technologies (diffusion, oxidation)
- thin film deposition (RF sputtering)
- bulk and surface micromachining of silicon
- wafer bonding
- epitaxial thin film growth
- scanning probe nanolithography
- Wafer dicing
- bonding and encapsulation
Characterization methods
- Atomic force microscopy
- FTIR spectrophotometry (0.8-27 micrometer)
- FTIR microscopy (2-27 micrometer, 50 x 50 micrometer)
- UV-vis spectrophotometry
- Environmental chamber testing
- Profilometer thickness control
- Absolute and gauge pressure, pressure difference, level transmitter calibration (certified lab for Ex-proof devices)
- Blackbody measurements
- Photodetector characterization (incl. sensitivity, NEP, D*)
- Response time measurements
- Lifetime & burn-in tests for semiconductor devices
- Capacitance-voltage measurements
- Large volume in-chip device testing (automatic prober)
- High magnetic fields & cryogenic measurements
- Photoacoustic characterization
